American Packaging Summit 2027

The American Packaging Summit is a 2-day executive-level event for senior packaging leaders and solution providers, held at The Westin Lombard (Chicago area), Lombard, Illinois. It’s designed for high-value, peer-to-peer learning and curated networking around the strategies and technologies shaping packaging right now.

What you can expect to get (and why it’s worth attending):

• You will learn what’s working now in sustainable packaging, including circular-economy progress, recyclable materials, rPET, compostables and emerging biomaterials—plus the operational realities of making them scale.
• If you attend, you’ll hear practical case studies across packaging innovation, design, materials, engineering and branding—focused on decision-ready insights rather than theory.
• You’ll sharpen how packaging drives brand and customer experience, with takeaways on digital printing, tactile finishes, compliance considerations and storytelling that influences the shelf (and the scroll).
• You’ll see where packaging tech is headed, including automation, robotics, AI-enabled production, smart labeling and digital twins—useful for anyone planning modernization or capex.
• You can expect structured, efficient networking, including pre-arranged 1-to-1 meetings and a strong focus on connecting with the right people based on shared priorities and investment areas.
• You’ll benchmark your roadmap against senior peers, with a room built around leadership-level conversations and real-world constraints.

This is a **paid **event with restricted, qualification-based access (invitation-only / request access).

For the full agenda, speaker updates, and registration requirements, check the event website for the latest details.